Risk Mitigation

SCL Standard Inspection

External visual inspection:

Visual examination should be performed on at least 10% of components in accordance with MILD-STD-883 method 2009.9, Acceptability of Electronic Components Distributed in the Open Market. External visual shall also include examination for evidence of prior use: Secondary coating, socket pulls, re-tinning, lead reforming etc. Used components are not allowed unless written authorization is provided by customer.

Resistance to solvents inspection for evidence of remarking or resurfacing (one part per LDC):

One sample from each lot date code shall be tested for evidence of remarking or resurfacing. Industry standard “resistance to solvents” test methods (see MIL-STD-202, Method 215, or JESD22-B107C) or Heated Chemical Test shall be performed to reveal any forged markings, coatings applied to disguise sanding marks, and other indications that the original device marking has been removed or covered.

Internal die examination (one part per LDC):

An internal package visual examination shall be performed on a sample of one component from each manufacturer lot date code. The die markings and internal features of the package shall be examined to validate authenticity.

Testing Requirements

Electrical testing (10% or 100pcs of components):

Parts shall be10% or 100pcs electrically screened DC function test or minimum Pin Correlation test for BGA devices done at 25 degrees C to the original manufacturer’s data sheet requirements. The Percent Defective Allowed (PDA) for the electrical screening tests is 1.0%. If the PDA is exceeded, customer and supplier will be notified, parts shall not be delivered without prior approval by customer and supplier.PDA applies only to testing.

Typical test by device’s family:

Discrete Components

1 to 3 of the Device’s Primary Characteristics is verified at 25C. This may include the following:

* Forward Bias Voltage * Threshold Voltage

* Reverse Bias Voltage * On Resistance

* Breakdown Voltage * Av, Hfe, or Gain

* Imax current or Operating Current

Simple Analog Components

1 to 3 of the Device’s Primary Characteristic’s is verified at 25C. This may include the following:

* Forward Bias * Breakdown Voltage * Av, hfe, or Gain

* Reverse Bias * On Resistance * Threshold Voltage

Simple Digital Components

1 to 3 of the Devices Primary Characteristic’s is verified at 25C. This may include the following:

*Shutdown or Tri-state * VOH/VOL at specified Load

*ICC (quiescent or operating) * VIH/VIL

* Truth Table verification * Min/Max Operating Voltage

Complex Analog and Digital Components

Example Components – High Pin count devices such as: Microprocessors, Microprocessor Controllers Broadcom devices, CPU controlled devices.

*Pin Correlation

*Is designed to correlate the pin characteristic of the device to the manufacturer’s specification and check for open and shorts. This test does not considered a function test but will be able to determine the authenticity of the devices.

*IDCODE Verification

FPGA Devices

*Pin Correlation

*25C Testing of FPGA programming (Configuration and Read back) and/or IDCODE Verification.